Semiconductor laser apparatus and method for manufacturing same

摘要

The semiconductor laser device of the present invention has a conductive first heatsink member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is disposed on the first heatsink member, and the semiconductor laser element is disposed on the first adhesive. The first adhesive reaches an upper part of the side surface of the first heatsink member under the laser emission surface for laser emission of the semiconductor laser element. The structure further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element.

主权项

1. A semiconductor laser device comprising:
a conductive first heatsink member; a conductive first adhesive disposed on the conductive first heatsink member; a semiconductor laser element disposed on the conductive first adhesive; an antireflection film formed on a laser emission surface of the semiconductor laser element; a conductive second heatsink member; a conductive second adhesive disposed on a first portion of the conductive second heatsink member, the conductive first heatsink member being disposed on the conductive second adhesive; an insulating adhesive tape disposed on a second portion of the conductive second heatsink member; and a conductive bonding plate disposed on the insulating adhesive tape, wherein, the conductive first adhesive reaches a side surface of the conductive first heatsink member on a laser emission side under the laser emission surface of the semiconductor laser element; an affinity of the antireflection film for the conductive first adhesive is lower than an affinity of the conductive first heatsink member for the conductive first adhesive, the conductive first adhesive formed on an upper part of the side surface of the conductive first heatsink member on the laser emission side has a thickness greater than a thickness of the conductive first adhesive disposed on other parts other than the upper part of the side surface of the conductive first heatsink member on the laser emission side, and the conductive bonding plate is formed into a U-shape in a planar view so as to surround the semiconductor laser element.