Bonding pad structure

摘要

A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

主权项

1. A bonding pad structure for connecting an electronic component mounted on a printed circuit board (PCB), said structure, comprising:
two bonding pad units, symmetrically disposed with respect to an axial line; wherein, each bonding pad unit has at least two bonding pads, each of the at least two bonding pads is composed of at least one first bonding pad and at least one second bonding pad in a manner that the first bonding pad is arranged next to the axial line,and the second bonding pad is arranged at a side of the corresponding first bonding pad that is away from the axial line, and further the first bonding pad and the corresponding second bonding pad are interconnected to each other by a first neck portion:
wherein the first bonding pad, the second bonding pad, and the first neck portion are used for soldering the electronic component so as a plurality of solder areas of different sizes are formed by interconnecting the two bonding pad units.