发明名称 |
Semiconductor light-emitting element manufacturing method, lamp, electronic equipment, and mechanical apparatus |
摘要 |
A semiconductor light-emitting element manufacturing method including: a first step in which a first n-type semiconductor layer is laminated onto a substrate in a first organometallic chemical vapor deposition apparatus; and a second step in which a regrowth layer, a second n-type semiconductor layer, an active layer, and a p-type semiconductor layer are sequentially laminated onto the aforementioned first n-type semiconductor layer in a second organometallic chemical vapor deposition apparatus. |
申请公布号 |
US8896085(B2) |
申请公布日期 |
2014.11.25 |
申请号 |
US201013382749 |
申请日期 |
2010.07.09 |
申请人 |
Toyoda Gosei Co., Ltd. |
发明人 |
Sakai Hiromitsu |
分类号 |
H01L21/36;H01L33/00;H01L33/02 |
主分类号 |
H01L21/36 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A semiconductor light-emitting element manufacturing method comprising:
a first step in which a first n-type semiconductor layer is laminated onto a substrate in a first organometallic chemical vapor deposition apparatus; and a second step in which a regrowth layer, a second n-type semiconductor layer, an active layer, and a p-type semiconductor layer are sequentially laminated onto said first n-type semiconductor layer in a second organometallic chemical vapor deposition apparatus, wherein the regrowth layer is a regrowth layer of the first n-type semiconductor layer laminated in the first step, said first n-type semiconductor layer and regrowth layer are n-contact layers, and said second n-type semiconductor layer is an n-clad layer. |
地址 |
Aichi JP |