发明名称 Semiconductor light-emitting element manufacturing method, lamp, electronic equipment, and mechanical apparatus
摘要 A semiconductor light-emitting element manufacturing method including: a first step in which a first n-type semiconductor layer is laminated onto a substrate in a first organometallic chemical vapor deposition apparatus; and a second step in which a regrowth layer, a second n-type semiconductor layer, an active layer, and a p-type semiconductor layer are sequentially laminated onto the aforementioned first n-type semiconductor layer in a second organometallic chemical vapor deposition apparatus.
申请公布号 US8896085(B2) 申请公布日期 2014.11.25
申请号 US201013382749 申请日期 2010.07.09
申请人 Toyoda Gosei Co., Ltd. 发明人 Sakai Hiromitsu
分类号 H01L21/36;H01L33/00;H01L33/02 主分类号 H01L21/36
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A semiconductor light-emitting element manufacturing method comprising: a first step in which a first n-type semiconductor layer is laminated onto a substrate in a first organometallic chemical vapor deposition apparatus; and a second step in which a regrowth layer, a second n-type semiconductor layer, an active layer, and a p-type semiconductor layer are sequentially laminated onto said first n-type semiconductor layer in a second organometallic chemical vapor deposition apparatus, wherein the regrowth layer is a regrowth layer of the first n-type semiconductor layer laminated in the first step, said first n-type semiconductor layer and regrowth layer are n-contact layers, and said second n-type semiconductor layer is an n-clad layer.
地址 Aichi JP