发明名称 Manufacturing method of pneumatic tire and manufacturing apparatus of pneumatic tire
摘要 An annular rubber member is molded, across a through hole, on a support surface of a support device that includes the support surface and the through hole which opens to the support surface. The rubber member molded on the support surface is arranged so as to oppose a sidewall unit of a shaped tire intermediate body. The support device is moved close to the tire intermediate body and the rubber member on the support surface is brought into contact with the sidewall unit. The rubber member is adhered to the sidewall by moving the press member that presses the rubber member to the side wall unit via the through hole, in a tire radial direction.
申请公布号 US8894785(B2) 申请公布日期 2014.11.25
申请号 US201213682458 申请日期 2012.11.20
申请人 Toyo Tire & Rubber Co., Ltd. 发明人 Teshima Toshiharu
分类号 B29D30/72;B29D30/10 主分类号 B29D30/72
代理机构 Westerman, Hattori, Daniels & Adrian, LLP 代理人 Westerman, Hattori, Daniels & Adrian, LLP
主权项 1. A manufacturing method of a pneumatic tire, wherein an annular rubber member is molded, across a through hole, on a support surface of a support device that includes the support surface and the through hole which opens to the support surface, wherein the rubber member molded on the support surface is arranged so as to oppose a sidewall unit of a shaped tire intermediate body, wherein the support device is moved close to the tire intermediate body and the rubber member on the support surface is brought into contact with the sidewall unit, wherein a press member presses the rubber member to the sidewall unit via the through hole, and wherein the rubber member is adhered to the sidewall unit by moving the press member that presses the rubber member to the sidewall unit via the through hole, in a tire radial direction, and then moving the support device apart from the tire intermediate body to peel off the rubber member from the support surface of the support device, wherein the rubber member on the support surface is brought into contact with the sidewall unit by bending the support device.
地址 Osaka-shi JP