发明名称 |
Method of fabricating integrated semiconductor device with MOS, NPN BJT, LDMOS, pre-amplifier and MEMS unit |
摘要 |
A method of fabricating an integrated semiconductor device, comprising: providing a substrate having a first region and a second region; and forming a semiconductor unit on the first region and forming a micro electro mechanical system (MEMS) unit on the second region in one process. |
申请公布号 |
US8897470(B2) |
申请公布日期 |
2014.11.25 |
申请号 |
US200912533055 |
申请日期 |
2009.07.31 |
申请人 |
Macronix International Co., Ltd. |
发明人 |
Huang Hsueh-I;Lee Ming-Tung;Tu Shuo-Lun |
分类号 |
H04R17/02;B81C1/00 |
主分类号 |
H04R17/02 |
代理机构 |
McClure, Qualey & Rodack, LLP |
代理人 |
McClure, Qualey & Rodack, LLP |
主权项 |
1. An integrated semiconductor device, comprising:
a substrate having a first region and a second region, wherein the first region and the second region are non-overlapping; a semiconductor unit formed on the first region; and a micro electro mechanical system (MEMS) unit formed on the second region, wherein the MEMS unit comprises a microphone comprising: a semiconductor diaphragm having a first diaphragm surface having a plurality of cavities formed in only a partial thickness of the semiconductor diaphragm and exposed to air, and a second diaphragm surface without a cavity and opposite to the first diaphragm surface; an interlayer dielectric disposed on the second diaphragm surface of the semiconductor diaphragm; and a metal layer disposed on the interlayer dielectric, wherein the second diaphragm surface of the semiconductor diaphragm is exposed to an opening passing through the interlayer dielectric and the metal layer. |
地址 |
Hsinchu TW |