Semiconductor packages having multiple lead frames and methods of formation thereof

摘要

In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead frame, which has a second die paddle and a plurality of leads. The second die paddle is disposed over the first die paddle. A semiconductor chip is disposed over the second die paddle. The semiconductor chip has a plurality of contact regions on a first side facing the second lead frame. The plurality of contact regions is coupled to the plurality of leads.

主权项

1. A semiconductor package comprising:
a first lead frame; a second lead frame, wherein the first lead frame is disposed over the second lead frame, and wherein the first lead frame comprises a die paddle and a plurality of leads; and a semiconductor chip disposed over the first lead frame, the semiconductor chip coupled to the plurality of leads, wherein the first lead frame is disposed between the semiconductor chip and the second lead frame, wherein the die paddle and at least one lead of the plurality of leads overlaps with and mechanically supports a major surface of the semiconductor chip, wherein the semiconductor chip comprises a transistor comprising a source region, a gate region, and a drain region, wherein the first lead frame comprises a die paddle coupled to the source region, and wherein the plurality of leads comprise a source lead coupled to the die paddle, a drain lead coupled to the drain region, and a gate lead coupled to the gate region.