Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance

摘要

A thermoelectric heat exchanger component includes a circuit board and multiple thermoelectric devices attached to the circuit board. Heights of at least two of the thermoelectric devices are different due to, for example, tolerances in a manufacturing process for the thermoelectric devices. The thermoelectric heat exchanger component also includes a first heat spreading lid over a first surface of the thermoelectric devices and a second heat spreading lid over a second surface of the thermoelectric devices. A thermal interface material is present between each one of the thermoelectric devices and the first and second heat spreading lids. The first heat spreading lid and the second heat spreading lid are oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is optimized for the thermoelectric devices.

主权项

1. A thermoelectric heat exchanger component, comprising:
a circuit board; a plurality of thermoelectric devices attached to the circuit board, wherein two or more of the plurality of thermoelectric devices have different heights relative to the circuit board; a heat spreading lid over the plurality of thermoelectric devices; and a thermal interface material between the plurality of thermoelectric devices and the heat spreading lid; wherein the heat spreading lid is oriented such that the thickness of the thermal interface material, and thus a thermal interface resistance, is minimized for the plurality of thermoelectric devices.