Light emitting diode package

摘要

The present invention relates to a light emitting diode package which can reduce a wire length, and can improve heat and light resistance. The light emitting diode package includes a molded portion having a housing, a plurality of light emitting chips housed in the housing, a plurality of main lead portions having the plurality of light emitting chips mounted thereto respectively, at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with a wire for electrically connecting the plurality of light emitting chips each other.

主权项

1. A light emitting diode package comprising:
a molded portion having a housing; a plurality of light emitting chips housed in the housing; a plurality of main lead portions on which the plurality of light emitting chips is mounted, respectively; and at least one sub-lead portion formed spaced from the main lead portions and electrically connected to at least any one of the plurality of main lead portions and the plurality of light emitting chips with wires for electrically connecting the plurality of light emitting chips each other, wherein the plurality of light emitting chips includes first to third light emitting chips, wherein the plurality of main lead portions includes a first main lead portion on which the first light emitting chip is mounted, a second main lead portion on which the second light emitting chip is mounted, and a third main lead portion on which the third light emitting chip is mounted, wherein at least one of the sub-lead portion includes first and third sub-lead portions positioned on both sides of a space between the first and second main lead portions, and second and fourth sub-lead portions positioned on both sides of a space between the second and third main lead portions, and wherein the first to third light emitting chips are connected in parallel as the first light emitting chip has a first terminal connected to an anode through the first main lead portion, the first light emitting chip has a second terminal connected to a cathode through the third and fourth sub-lead portions and the third main lead portion, the second light emitting chip has a third terminal connected to the anode through the first sub-lead portion and the first main lead portion, the second light emitting chip has a fourth terminal connected to the cathode through the fourth sub-lead portion and the third main lead portion, the third light emitting chip has a fifth terminal connected to the anode through the first and second sub-lead portions and the first main lead portion, and the third light emitting chip has a sixth terminal connected to the cathode through the third main lead portion.