SUBSTRATE FOR PACKAGE AND METHOD FOR THE SAME AND ELECTRO COMPONENT PACKAGE AND METHOD FOR THE SAME

摘要

Disclosed are a substrate for a package, a manufacturing method thereof, an electronic device package, and a manufacturing method thereof. The substrate for a package comprises: a base substrate which has pads and circuit patterns on one surface; a solder resist coated on the base substrate to expose the pads to the outside; and multiple posts which are formed on the solder resist by corresponding to the edge position of a first electronic device to support the first electronic device through the ink jetting of an ink jet. A space, in which a second electronic device having a narrower width than the first electronic device is received, is formed on the inner side of the posts.