| 发明名称 | Wire bonding method in circuit device | ||
| 摘要 | A wire bonding method in a circuit device mounted on a lead frame, the wire bonding method including: counting a stop time if an operation of a capillary stops; removing a contaminated free air ball (FAB) formed on an end of the capillary if the stop time exceeds a reference time; forming a new FAB; and restarting a wire bonding process. | ||
| 申请公布号 | US8893953(B2) | 申请公布日期 | 2014.11.25 |
| 申请号 | US201313754035 | 申请日期 | 2013.01.30 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Lee Joon-gil |
| 分类号 | B23K31/02;B23K20/00;H01L23/00;H01L21/66 | 主分类号 | B23K31/02 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A wire bonding method in a circuit device, the wire bonding method comprising: detecting a stop time duration while an operation of a capillary is stopped; removing a contaminated free air ball (FAB) formed on a wire at an end of the capillary if the stop time duration exceeds a reference time; and forming a new FAB and restarting a wire bonding process. | ||
| 地址 | Suwon-si KR | ||