Printed circuit board structure

摘要

A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof.

主权项

1. A printed circuit board structure comprising a plurality of circuit layer plates stacked together, and each of the circuit layer plates comprising:
an epoxy resin plate body; and a fiber fabric completely encapsulated inside the epoxy resin plate body, wherein each of the circuit layer plates which is stacked between two of the circuit layer plates is further provided with filler particles distributed in the epoxy resin plate body of the circuit layer plate; and wherein, in all of the circuit layer plates, the two opposite and outermost circuit layer plates thereof are provided with metal soldering pads on outer surfaces of the epoxy resin plate bodies of the two opposite and outermost circuit layer plates, respectively, and both the two opposite and outermost circuit layer plates thereof are free of the filler particles in the epoxy resin plate body thereof.