| 摘要 |
<p>The present invention relates to a heat resistant surface protective adhesive tape with a silicon film layer for laser cutting and, more specifically, to a heat resistant surface protective adhesive tape for laser processing which protects a stainless steel surface from heat, pollutants and the like generated in a laser cutting process for a precise cutting process of stainless steel used in an elevator, a railroad car, an electronic appliance and the like. The heat resistant surface protective adhesive tape with a silicon film layer for laser processing of the present invention comprises: a silicon film layer wherein 5-30 parts by weight of silicon is mixed in 100 parts by weight of polyethylene; a polyethylene layer formed on an upper side of the silicon film layer; and an adhesion layer formed on an upper side of the polyethylene layer.</p> |
