| 摘要 |
<p>According to an embodiment of the present invention, a circuit board includes: a substrate (10) which includes an upper surface, a lower surface facing the upper surface, and side surfaces connecting the upper surface with the lower surface, and has thermal conductivity; an insulation layer (20) formed on the substrate; and a conductive pattern (30) formed on the insulation layer. At least one from the upper surface and the lower surface of the substrate includes: a first area (11) which is flat; and a second area which has the roughened surface, and allows the insulation layer to be formed thereon. According to the embodiments of the present invention, heat dissipation and light reflection can be significantly increased by forming the first area where an electrical element is mounted into a reflecting surface, which is flat and made of a material having high thermal conductivity. The insulation layer is formed on the roughened area, thus, adhesiveness or adhesion between the substrate and the insulation layer can be increased.</p> |
