| 摘要 |
<p>The present invention provides an Ag-In alloy sputtering target for which abnormal discharge and splashing are reduced when sputtering to form a reflector electrode film from an Ag-In alloy. This Ag-In alloy sputtering target has a composition that contains 0.1-1.5 atom% of In, with the remainder consisting of Ag and unavoidable impurities. The content of each of the elements Si, Cr, Fe and Ni is 30 ppm or lower and the total content of these elements is 90 ppm or lower.</p> |
