发明名称 RESISTANCE SWITCHING MEMORY DEVICE AND METHOD OF THE SAME
摘要 <p>According to the present invention, provided is a method for manufacturing a resistance change memory element of 3D lamination structure, which includes a step of forming a metal film and an insulating film on a substrate; a step of exposing a contact hole to a surface of the substrate by patterning the contact hole by using etching; a step of forming a resistance change oxide film all over the contact hole, the surface of the substrate, and the insulating film; and a step of forming an upper electrode on the resistance change oxide film and forms the contact hole into a non-circular shape in the etching step to make an electrical passage of a filament type indicated irregularly according to a position of the resistance change oxide film.</p>
申请公布号 KR20140134428(A) 申请公布日期 2014.11.24
申请号 KR20130054267 申请日期 2013.05.14
申请人 INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY 发明人 SOHN, HYUN CHUL;KO, DAE HONG;LEE, KYU MIN;KIM, JONG GI
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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