PRINTED CIRCUIT BOARD

摘要

The present invention relates to a printed circuit board. The printed circuit board according to an embodiment of the present invention comprises a base substrate; an upper buildup layer formed on the upper part of the base substrate and including one or more layers of upper insulation layer and upper circuit layer; and a buildup layer formed on the lower part of the base substrate, having thickness different from that of the upper buildup layer, and including one or more layers of lower insulation layer and lower circuit layer.