CURABLE RESIN COMPOSITION

摘要

The present invention solves the problem of the difficulty of imparting satisfactory adhesive properties. Provided is a curable resin composition that contains components (A) to (D). (A) 100 parts by mass of an oligomer which has a (meth)acryloyl group and which has a diene-based or hydrogenated diene-based skeleton, (B) more than 400 parts by mass of an oligomer which does not have a (meth)acryloyl group and which has a diene-based or hydrogenated diene-based skeleton, (C) more than 100 parts by mass of a (meth)acrylate having an aromatic ring, and (D) a photopolymerization initiator. Furthermore, the composition may contain a silane coupling agent and may be used as an adhesive composition.