METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE

摘要

A method for manufacturing a semiconductor light emitting device package according to an embodiment of the present invention includes the steps of: preparing a light emitting structure which includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are successively stacked on a growth substrate; forming a first electrode and a second electrode which are connected to the first conductive semiconductor layer and the second conductive semiconductor layer respectively, on a first surface of the light emitting structure on which the second conductive semiconductor layer is formed; attaching a support substrate on the first surface of the light emitting structure; removing the growth substrate; attaching a light transmitting substrate including a wavelength change material on a second surface of the light emitting structure to remove the growth substrate; and removing at least a part of the support substrate.