| 摘要 |
<p>A silver alloy sputtering target having a component composition containing a total of 0.1 to 1.5% by mass of In and/or Sn, which are elements that form a solid solution in Ag, with the remainder being made up by Ag and unavoidable impurities, the average grain diameter of the crystal grains being 1μm to less than 30μm, and fluctuations in the grain diameter of the crystal grains being no greater than 30% of the average grain diameter. The silver alloy sputtering target is manufactured by subjecting a melt-cast ingot to a hot rolling step, a cooling step, cold rolling, heat processing, and a machining processing step, in the stated order.</p> |
