| 摘要 |
<p>PURPOSE: A semiconductor package slimming apparatus and a method thereof are provided to perform a uniform polishing process by controlling the height of a grindstone in real time according to various shapes. CONSTITUTION: A table (10) vacuum-adsorbs a semiconductor package. A grindstone (21) polishes the adsorbed semiconductor package. A control device displaces the grindstone. The control device includes a sensor (41) and a driving part. The sensor measures the height of the semiconductor package in real time.</p> |
