| 摘要 |
A pad is installed in an electronic component. The pad includes a lower transparent electrical conductive layer formed on an insulating substrate. An insulating layer is formed on the lower transparent electrical conductive layer. A contact hole is formed in the insulating layer to expose the lower transparent electrical conductive layer. A metal layer is formed on the lower transparent electrical conductive layer to surround the contact hole and covered by the insulating layer. An upper transparent electrical conductive layer is formed on the insulating layer and connected to the lower transparent electrical conductive layer through the contact hole. |
