发明名称 WIRE CUTTING TOOL MANUFACTURING METHOD THEREOF
摘要 <p>The present invention is related to a wire cutting tool used for cutting work of a material with high hardness such as a silicon ingot, a sapphire ingot, stone, a brick, or concrete, and to a manufacturing method thereof. More specifically, the wire cutting tool has a part of first and second deposition layers removed due to a dressing process of the wire cutting tool, thereby exposing an upper part of an abrasive particle to allow process completion to be checked easily.</p>
申请公布号 KR20140134027(A) 申请公布日期 2014.11.21
申请号 KR20130053623 申请日期 2013.05.13
申请人 EHWA DIAMOND IND. CO., LTD. 发明人 SUNG, NAK JOO;PARK, SANG WOOK
分类号 B23D61/18;B23P15/28;B24D18/00 主分类号 B23D61/18
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