发明名称 |
WIRE CUTTING TOOL MANUFACTURING METHOD THEREOF |
摘要 |
<p>The present invention is related to a wire cutting tool used for cutting work of a material with high hardness such as a silicon ingot, a sapphire ingot, stone, a brick, or concrete, and to a manufacturing method thereof. More specifically, the wire cutting tool has a part of first and second deposition layers removed due to a dressing process of the wire cutting tool, thereby exposing an upper part of an abrasive particle to allow process completion to be checked easily.</p> |
申请公布号 |
KR20140134027(A) |
申请公布日期 |
2014.11.21 |
申请号 |
KR20130053623 |
申请日期 |
2013.05.13 |
申请人 |
EHWA DIAMOND IND. CO., LTD. |
发明人 |
SUNG, NAK JOO;PARK, SANG WOOK |
分类号 |
B23D61/18;B23P15/28;B24D18/00 |
主分类号 |
B23D61/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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