| 摘要 |
<p>The present invention provides a further improvement use for restraining generation of Sn powder caused by friction in a Sn plated material. The present invention provides a Sn plated material which has a reflow Sn-plated layer disposed directly on a copper or copper alloy base material or arranged therebetween through a base plating layer, wherein the reflow Sn-plated layer is composed by an upper-side Sn layer and a lower-side Cu-Sn layer, and Cu-Sn alloy particles with particle sizes thereof being between 10-100 nm exist in a number density of 50-1000/[mu]m<2> when cross section observation is carried out on the Sn layer.</p> |
