SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing apparatus includes a plurality of chuck pins disposed around a substrate; and a heat source disposed above the substrate. The plurality of chuck pins include a conductive member formed with material including carbon; and a fin cover covering the conductive member. The conductive member includes a gripping unit softer than the substrate and pressed and attached at a circumferential portion of the substrate, wherein the the gripping unit is protruded outward from an outer circumference of the substrate when viewed from a flat surface while being pressed and attached at the circumferential portion of the substrate. The fin cover covers a portion of the conductive member having the gripping unit protruded outward from the outer circumference of the substrate when viewed from the flat surface while being pressed and attached at the circumferential portion of the substrate when viewed from the flat surface.