发明名称 THE STRUCTURE FOR SOUNDPROOF INTERLAYER
摘要 The present invention relates to an inter-story noise prevention structure including multiple layers. The inter-story noise prevention structure according to an embodiment of the present invention is arranged on a floor slab of a structure. The inter-story noise prevention structure includes: a floor structure including a flat unit and multiple recess units arranged to recess below the flat unit and be spaced apart from each other; a heat insulation material which is inserted into the spaces formed between the recess units and is spaced apart from the lower surface of the flat unit by a predetermined space; and multiple anti-vibration pads which are respectively coupled to the lower surface of the recess units and are supported by the floor slab.
申请公布号 KR20140134051(A) 申请公布日期 2014.11.21
申请号 KR20130053671 申请日期 2013.05.13
申请人 FOR-U ENGINEERING CO., LTD.;CHOI, YOUNG DEOK 发明人 CHOI, YOUNG DEOK
分类号 E04F15/20 主分类号 E04F15/20
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