发明名称 |
THE STRUCTURE FOR SOUNDPROOF INTERLAYER |
摘要 |
The present invention relates to an inter-story noise prevention structure including multiple layers. The inter-story noise prevention structure according to an embodiment of the present invention is arranged on a floor slab of a structure. The inter-story noise prevention structure includes: a floor structure including a flat unit and multiple recess units arranged to recess below the flat unit and be spaced apart from each other; a heat insulation material which is inserted into the spaces formed between the recess units and is spaced apart from the lower surface of the flat unit by a predetermined space; and multiple anti-vibration pads which are respectively coupled to the lower surface of the recess units and are supported by the floor slab. |
申请公布号 |
KR20140134051(A) |
申请公布日期 |
2014.11.21 |
申请号 |
KR20130053671 |
申请日期 |
2013.05.13 |
申请人 |
FOR-U ENGINEERING CO., LTD.;CHOI, YOUNG DEOK |
发明人 |
CHOI, YOUNG DEOK |
分类号 |
E04F15/20 |
主分类号 |
E04F15/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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