COF TYPE SEMICONDUCTOR CHIP PACKAGE WITH HEAT-RADIATION CONSTRUCTION

摘要

A COF type semiconductor chip package has a single-layer semiconductor chip which is placed on a film and connected to electrode patterns by bumps. A first heat radiating resin layer is spread between the semiconductor chip and the film. A second heat radiating resin layer is spread on the side surface of the semiconductor chip on the film to expose the top surface of the semiconductor chip to the outside. According to the present invention, the semiconductor chip package improves heat radiating effects and does not cause errors in an inspection stage. Also, the semiconductor chip package enables the concentrated heat radiation of a side portion of the semiconductor chip where is largely heated and maximizes heat radiating effects because the semiconductor chip includes a thermal conductive material, such as Al or Cu, without the electrical short circuit of a heat radiating resin on the side surface of the chip.