| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of a semiconductor device.SOLUTION: A method of manufacturing a semiconductor device includes a step for arranging a plurality of semiconductor chips 1, 2 adjacently on the chip mounting surface of a die pad 6. The method of manufacturing a semiconductor device also includes a step for electrically connecting the semiconductor chips 1 and 2 via a wire 5cc. The pad (pad for connecting chips) 1pcc of the semiconductor chip 1 becoming the second bond side in the step for connecting the wire 5cc is provided such that the distance from the peripheral edge of the surface 1a of the semiconductor chip 1 becomes farther. |
