| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a transparent circuit board capable of cleanly performing desired pattern processing while reducing generation of an outgas derived from a temporary fixing material when, for example, high temperature processing of 200°C or higher is performed.SOLUTION: A method for manufacturing a transparent circuit board includes the steps of: preparing a laminate in which a transparent workpiece temporarily fixed on a support via a temporary fixing material; forming a pattern in the transparent workpiece by pattern processing including heat treatment of 200°C or higher and manufacturing a transparent circuit substrate (processing step); and peeling the transparent circuit substrate from the temporary fixing material. At least a part of the temporary fixing material is formed of at least polyimide or polyamide-imide.</p> |
