发明名称 COOLER FOR ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a cooler for electronic components with a flow path structure making temperature of a coolant increase slowly when the coolant supply is stopped, which can extend a supply stop time.SOLUTION: A cooler for electronic components comprises: a main body 2 made in a cylindrical body with a bottom, in which an opening at one end faces in a side direction, and in which an outer surface of a wall part positioned at a lower side of a peripheral wall is set as an attaching face for an electronic component 12; a lid member 5 attached onto the main body 2 so as to cover the opening at the one opening end of the main body 2; a division plate 3 arranged in a space configured by the main body 2 and the lid member 5, and forming an upper flow path 4a, a lower flow path 4b and a communication flow path 4c; a coolant entrance nipple 6 formed on the lid member 5, for supplying the coolant to the upper flow path 4a; and a coolant exit nipple 7 formed at the lid member 5, for discharging the coolant flowing in the lower flow path 4b. A communication hole 8 is formed in the division plate 3 so as to communicate the upper path 4a with the lower path 4b, at a position above the electronic component 12.</p>
申请公布号 JP2014220452(A) 申请公布日期 2014.11.20
申请号 JP20130100004 申请日期 2013.05.10
申请人 MITSUBISHI ELECTRIC CORP 发明人 SAKATA KAZUKI
分类号 H01L23/473;H05K7/20 主分类号 H01L23/473
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