MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component which is free from such a problem that the multilayer ceramic electronic component topples over when mounted on a printed circuit board or the like even if the thickness of the multilayer ceramic electronic component becomes larger than width due to increase in the number of layers, and to provided a board for mounting the multilayer ceramic electronic component.SOLUTION: The multilayer ceramic electronic component includes: a ceramic body which includes a plurality of dielectric layers and satisfies T/W>1.0, where W is the width of the ceramic body and T is the thickness thereof, and which includes a longitudinal groove part recessed inward on at least one main surface; a plurality of first and second internal electrodes which are arranged to face each other through the dielectric layer in the ceramic body and exposed alternately from both end surfaces of the ceramic body; and first and second external electrodes which are formed from both end surfaces of the ceramic body to one main surface where the groove part is formed, and which are connected electrically to the first and second internal electrodes respectively. When the ceramic body is divided into an upper region At corresponding to 70-90% of the overall thickness of the ceramic body and a lower region Ab corresponding to 10-30% of the overall thickness of the ceramic body, (the average particle size of Ab material/the average particle size of At material)<0.5 is satisfied.