COMPONENT-EMBEDDED SUBSTRATE AND COMMUNICATION MODULE

摘要

A component-embedded substrate (1) is provided with a first embedded component (13) having electrically connected terminals and located in a layer close to mounting electrodes (17) of a multilayered substrate (10) produced by layering a plurality of resin films comprising a thermoplastic resin, and a second embedded component (11) having electrically connected terminals and located in a layer farther from the mounting electrodes (17) than the layer in which the first embedded component (13) is located, the number of terminals in the first embedded component (13) being greater than the number of terminals in the second embedded component (11). Much of the internal wiring from the first embedded component (13) and the second embedded component (11) is directed to the mounting surface where the mounting electrodes (17) are provided. However, since the first embedded component (13) has a smaller surface area than the second embedded component (11) in a planar view and is situated more to the mounting surface side than the second embedded component (11), a space for routing the internal wiring can be secured on the mounting surface side of the multilayered substrate (10).