| 摘要 |
<p>The invention relates to an implant (1) for osteosynthesis, which is pressed against the bone by means of one or more encircling wires, cables or bands and, in the contact zones (11) specifically provided for the purpose on the underside of the implant, bonds to the bone under the contact pressure such that a displacement of the bone relative to the implant is prevented.</p> |
