| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer cutting method which avoids the necessity of preparing special equipment and enables cutting of a wafer while resolving clogging of a cutting blade without interrupting a cutting operation.SOLUTION: A cutting method of a wafer W for cutting the wafer W along a plurality of streets by relatively transferring with respect to a cutting blade 15, the wafer W in which a device is formed by a laminate laminated on a surface of a substrate 65 in a direction orthogonal to a rotational axis of the cutting blade 15 comprises: a laminate removal process of removing the laminate by cutting the wafer W with the cutting blade 15 to a depth deeper than a thickness of the laminate to reach the middle of the substrate 65 and relatively transferring the wafer W along the streets to form a cut groove 66; and a dressing process of cutting deeply into the wafer W with the cutting blade 15 along the cut groove 66 and relatively transferring and cutting the wafer W along the cut groove 66 and dressing the cutting blade 15 after removing the laminate adhering to a tip of the cutting blade 15. |
