发明名称 SEMICONDUCTOR INSPECTION DEVICE AND SEMICONDUCTOR INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To perform a reliable inspection for solder voids and accurately determine the quality of a semiconductor device.SOLUTION: A semiconductor inspection device 1 includes: current sources 4 and 5 having one end electrically connected to a connection terminal 2 and the other end electrically connected to a connection terminal 3; a voltage detection unit 6 that detects voltage between the connection terminals 2 and 3; a forced discharge unit 7 that is constituted so as to allow charges, which are accumulated in an electrostatic capacitor of a semiconductor element 31,to be forcefully discharged; and a control unit 8 that controls the current sources 4 and 5, and the forced discharge unit 7. In testing a semiconductor device 30, the control unit 8 controls the forced discharge unit 7, after turning off a heating current of the current source 5, so as to discharge the charges accumulated in the electrostatic capacitor over a predetermined discharge time; acquires a difference between a voltage Vm, which is detected by the voltage detection unit 6 before the heating current is caused to flow, and a voltage Vm, which is detected by the voltage detection unit 6 after a charge time for charging the electrostatic capacitor by the current source 4 following the predetermined discharge time has passed; and determines the quality of the semiconductor device 30 on the basis of the difference.
申请公布号 JP2014219236(A) 申请公布日期 2014.11.20
申请号 JP20130097071 申请日期 2013.05.02
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 OKABAYASHI SHINTAROU
分类号 G01R31/26 主分类号 G01R31/26
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