| 摘要 |
The present invention addresses the issue of providing: a composite insulating resin material having low viscosity, ensured castability, and suppressed void generation inside the resin, for a resin material having 2-20 wt% of microparticles of no more than 100 nm added thereto; and a high-voltage device including said composite insulating resin material. Said issue is solved by providing: a composite insulating resin material for high-voltage devices, containing 2-20 wt% of microparticles that have a particle size of no more than 100 nm and including a nonionic surfactant having an HLB value of 2-8; and a high-voltage device including said composite insulation resin material. |
