| 摘要 |
[Problem] To cool a plurality of semiconductor elements by means of a cooling medium in a semiconductor device, a semiconductor device manufacturing method, and an electronic apparatus. [Solution] The problem is solved by means of a semiconductor device having: a first semiconductor element (22); a first substrate (25), which is provided on the first semiconductor element (22), and which is provided with a depressurized hollow (S); a cooling medium (C) contained in the hollow (S); a second semiconductor element (23) that is provided on the first substrate (25); and a heat dissipating member (30), which is thermally connected to the first substrate (25), and which is provided with a hole (30x) that is connected to the hollow (S). |
