发明名称 VIBRATING DEVICE
摘要 Provided is a vibrating device which is capable of further reducing the absolute value of the temperature coefficient of frequency (TCF). A vibrating device (1) in which a plurality of tuning fork tines (3 to 5) extending in the Y-direction are arranged in parallel in the X-direction on a base (2), the tuning fork tines (3 to 5) are provided with a configuration in which a silicon oxide layer (12) is layered upon a Si layer (11) which is a degenerate semiconductor and an excitation section (13) is provided upon the silicon oxide layer (12), and the thickness ratio T2/(T1+T2) is in the range of (-0.0002x2-0.0136x+0.0014)±0.05 when the total thickness of the Si layer (11) is T1, the total thickness of the silicon oxide layer (12) is T2, and the temperature coefficient of frequency (TCF) when a silicon oxide layer (12) is not provided on the Si layer (11) is x.
申请公布号 WO2014185281(A1) 申请公布日期 2014.11.20
申请号 WO2014JP62079 申请日期 2014.05.01
申请人 MURATA MANUFACTURING CO., LTD. 发明人 NISHIMURA, TOSHIO;HASE, TAKASHI;TAKEYAMA, KEISUKE;KAIDA, HIROAKI;UMEDA, KEIICHI;KISHI, TAKEHIKO;YAMADA, HIROSHI
分类号 H03H9/24;H03H9/02 主分类号 H03H9/24
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