| 摘要 |
A method for producing an optoelectronic component comprises steps for providing a semiconductor crystal which has a surface, for applying a first layer which has a dielectric to the surface, for applying and structuring a photoresist layer on the first layer, wherein the photoresist layer is structured in such a way that said photoresist layer has an opening, for partially separating the first layer in order to expose a lateral region of the surface, for applying a contact area which comprises a first metal in the lateral region of the surface, for removing the photoresist layer, for applying a second layer which comprises an optically transparent, electrically conductive material, and for applying a third layer which comprises a second metal. |
