发明名称 PARALLELISM ADJUSTMENT DEVICE AND PARALLELISM ADJUSTMENT METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a parallelism adjustment device and a parallelism adjustment method adjusting parallelism between a semiconductor surface and an electrode surface while reducing load to a semiconductor, and increasing operating speed to achieve shorter cycle time.SOLUTION: A probe device 1 for adjusting parallelism between a surface 100f of a power semiconductor 100 and a surface 21f of a contactor 21 of a contact body 2 applying a current to the power semiconductor 100 while contacting the surface 100f, includes a pressure body assembly 3 pressing the contact body 2 at a predetermined pressing force until the surface 100f of the power semiconductor 100 contacts the surface 21f of the contactor 21 of the contact body 2, and thereafter pressing the contact body 2 at a stronger pressing force than the predetermined pressing force.</p>
申请公布号 JP2014219275(A) 申请公布日期 2014.11.20
申请号 JP20130098605 申请日期 2013.05.08
申请人 HONDA MOTOR CO LTD 发明人 AKAHORI SHIGETO;KAMBARA MASAO
分类号 G01R1/067;H01L21/66 主分类号 G01R1/067
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