| 发明名称 |
HEAT CONDUCTIVE ADHESIVE FILM, METHOD FOR MANUFACTURING THE SAME AND OLED PANEL |
| 摘要 |
A method for manufacturing a heat conductive adhesive film includes: forming a non-solid heat conductive adhesive layer with cured particles on a substrate; forming several bumps on the non-solid heat conductive adhesive layer while performing curing, so as to yield the heat conductive adhesive film with several bumps. A heat conductive adhesive film and an OLED panel are provided. Several bumps are formed on a flat surface of the heat conductive adhesive film, thus increasing the surface area of the heat conductive adhesive film such that heat from the heat generating unit can be duly discharged. |
| 申请公布号 |
US2014342117(A1) |
申请公布日期 |
2014.11.20 |
| 申请号 |
US201314345815 |
申请日期 |
2013.09.17 |
| 申请人 |
BOE HYUNDAI LCD INC. ;BOE TECHNOLOGY GROUP CO., LTD. |
发明人 |
Wang Quanzhong;Gu Zhenhua;Zhu Moyu |
| 分类号 |
H01L51/52;H01L27/32 |
主分类号 |
H01L51/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a heat conductive adhesive film, comprising:
forming a non-solid heat conductive adhesive layer with cured particles on a substrate; forming several bumps on the non-solid heat conductive adhesive layer while performing curing, so as to yield the heat conductive adhesive film with several bumps. |
| 地址 |
Beijing CN |
