LASER COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

摘要

A laser component has a housing (400) in which a first carrier block (301) is arranged. A first laser chip (101) with an emission direction (131) is arranged on a longitudinal side (330) of the first carrier block (301). The first laser chip is electrically conductively connected to a first contact region (310), which is arranged on the first carrier block, and is electrically conductively connected to a second contact region (320), which is arranged on the first carrier block (301). A respective electrically conductive connection is established between the first contact region (310) and a first contact pin (401) of the housing (400) and also between the second contact region (320) and a second contact pin (402) of the housing. A linear arrangement of laser chips (101) is connected electrically in series on each carrier block (301, 302). The prefabricated modules on a carrier block can be tested in respect of the functioning thereof before they are mounted in the housing and contact is made with them (358). A ceramic heat sink (201, 202) can be located between each laser chip (101) and carrier block (301, 302).