发明名称 BONDING METHOD AND BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To soften the inner edge of a second work by pressing and heating substantially uniformly, when bonding the outer edge of a first work and the inner edge of a second work surrounding the outer edge, and to flow the inner edge thus softened to the outer edge of the first work.SOLUTION: A bonding device 40 has a first pressing portion 64 for pressing a first work (e.g., an electrolyte membrane/electrode assembly:MEA12), and a second pressing portion 66 for pressing a second work (e.g., a resin frame 14). The second pressing portion 66 is an assembly constituted by coupling a plurality of split pieces 80a-80d, and a cartridge heater 84 is embedded, as heating means, in each split piece 80a-80d.
申请公布号 JP2014220163(A) 申请公布日期 2014.11.20
申请号 JP20130099674 申请日期 2013.05.09
申请人 HONDA MOTOR CO LTD 发明人 KATSUNO MASAYUKI;UOZUMI AKIRA;FUJITSUKA RYUGO;OKIYAMA GEN
分类号 H01M8/02 主分类号 H01M8/02
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