发明名称 PRINTED WIRING BOARD MATERIAL AND PRINTED WIRING BOARD USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a printed wiring board material capable of suppressing generation of migration between holes and to provide a printed wiring board using the same.SOLUTION: The printed wiring board material includes: a binder component; a cellulose nanofiber having a number-average fiber diameter of 3 nm to 1000 nm; and a one or both of a silicone compound and a fluorine compound, which may be suitably used for interlayer insulation materials 6, 9 and a core material 2. The printed wiring board material is used for the printed wiring board.</p>
申请公布号 JP2014220341(A) 申请公布日期 2014.11.20
申请号 JP20130097985 申请日期 2013.05.07
申请人 TAIYO HOLDINGS CO LTD 发明人 SHIBATA DAISUKE;SUMIYA TAKENORI;ENDO ARATA;USHIKI SHIGERU;MIWA TAKAO
分类号 H05K3/46;H05K1/03 主分类号 H05K3/46
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