发明名称 |
RESIN COMPOSITION ELIMINATING VOLATILE LOSS OF INITIATING SPECIES FOR THE PREPARATION OF PRINTED CIRCUIT BOARD LAMINATES |
摘要 |
An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin. |
申请公布号 |
US2014343232(A1) |
申请公布日期 |
2014.11.20 |
申请号 |
US201314068655 |
申请日期 |
2013.10.31 |
申请人 |
International Business Machines Corporation |
发明人 |
Boday Dylan J.;Kuczynski Joseph |
分类号 |
H05K1/03;C08L71/12;C08L71/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
1. A resin, comprising:
a curable polymer; and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. |
地址 |
Armonk NY US |