WAFER LEVEL PACKAGING DEVICE

摘要

A wafer level packaging device is provided. The packaging device of the present invention comprises: a lower sensor substrate having a sensor; an upper cap substrate which is formed on the lower sensor substrate and has a cavity on one surface to receive the sensor; and a metal solder layer which bonds the lower sensor substrate to the upper cap substrate. A first reflow cut-off film for cutting off the reflow of the molten metal solder layer, which is generated when the upper and lower substrates are bonded to the gap between the sensor and the metal solder layer is formed on the lower sensor substrate.