| 摘要 |
<p>The present invention provides an apparatus for forming a thin film and a method for forming the same, and aims to reduce processes use for printing on thin films such as solder-resisting etching resist thin films. According to the apparatus and method for forming the thin film, a first spray head and a second spray head are placed faced with an object and spray out liquid materials with a first color and a second color respectively. A moving mechanism enables an objective table for holding the object to move towards the plane direction of the object in relative to the first spray head and the second spray head. A control apparatus controls the first spray head and the moving mechanism so as to form a first thin film on the object with the first color liquid material, and controls the second spray head and the moving mechanism so as to form a second thin film on the object with the second color liquid material.</p> |
