| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate having a plurality of continuous via conductors penetrating a plurality of ceramic layers coaxially in the thickness direction, and insulating only the continuous via conductors not requiring conduction, where the dimensions and shape of the substrate body are accurate, and to provide a manufacturing method capable of obtaining a multilayer ceramic substrate surely at a relatively low cost.SOLUTION: A multilayer ceramic substrate 1a includes a substrate body 2a laminating a plurality of ceramic layers 3-5, and a plurality of continuous via conductors 12 penetrating a plurality of adjacent ceramic layers 3-5 coaxially in the thickness direction in the substrate body 2a. At least one of the continuous via conductors 12 is insulated by a ceramic-based insulation layer 20 located between a plurality of ceramic layers 4, 5 adjacent in the continuous via conductors 12. Such an insulation layer 20 is located in a gap 13s within the wiring layer 13 formed between adjacent ceramic layers 4, 5, or in a gap 13g between a plurality of wiring layers 13. |
