| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of defects due to optical corrosion in a semiconductor device.SOLUTION: A method of manufacturing a semiconductor device includes: an insulating-layer formation step of forming an insulating layer having a recess on a substrate SUB; a conductive-film formation step of forming a conductive film in the recess and on the insulating layer; a polishing step of polishing the conductive film on the insulating layer to remove the film; a cleaning step of cleaning the insulating layer in a light-shielding state. Between the polishing step and the cleaning step or after the cleaning step, the presence or absence of the substrate SUB in the light-shielding state is detected by using an infrared sensor SNS1 and the substrate SUB is moved. |
