发明名称 TRANSPARENT INSULATION FILM-FORMING COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To provide a transparent insulation film-forming composition capable of forming a transparent insulation film having excellent transparency and high dielectric constant, a transparent insulation film obtained by using the transparent insulation film-forming composition, and a display device comprising the transparent insulation film.SOLUTION: One or more selected from the group consisting of a simple substance, an oxide, a chelate compound a salt and an alloy of an element accommodating an electron in the 4f orbit or the 5d orbit in the ground state is admixed as a filler with a transparent insulation film-forming composition. The transparent insulation film-forming composition is preferably a composition comprising (A) a filler, (B1) a compound having a group having an alicyclic epoxy group and (C) an acid generator, or a composition comprising (A) a filler and (B2) a resin, the (B2) resin being one or more selected from the group consisting of silicone resin, polyamide imide, polyimide, polycarbonate, polyether, polythioether and a polymer of a monomer having an ethylenically unsaturated double bond.</p>
申请公布号 JP2014220225(A) 申请公布日期 2014.11.20
申请号 JP20130182588 申请日期 2013.09.03
申请人 TOKYO OHKA KOGYO CO LTD 发明人 NODA KUNIHIRO;CHISAKA HIROKI;SHIODA MASARU
分类号 H01B3/44;C08K3/00;C08K5/00;C08L33/00;C08L63/00;C08L101/00;C09D5/25;C09D7/12;C09D133/14;C09D163/00;C09D201/00;H01B3/30;H01L21/312 主分类号 H01B3/44
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