发明名称 |
SEMICONDUCTOR PACKAGE DEVICE |
摘要 |
A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package substrate, a first trench formed in the lower molding compound layer to surround the lower semiconductor chip, and a second trench connected to the first trench to extend to an outer wall of the lower package, the second trench being formed in the lower molding compound layer, an upper package disposed on the lower package. The upper package includes an upper package substrate and at least one upper semiconductor chip mounted on the upper package substrate and a heat transfer member disposed between the lower package and the upper package. |
申请公布号 |
US2014339708(A1) |
申请公布日期 |
2014.11.20 |
申请号 |
US201414243165 |
申请日期 |
2014.04.02 |
申请人 |
JANG Eon Soo;PARK Kyol;IM YUNHYEOK |
发明人 |
JANG Eon Soo;PARK Kyol;IM YUNHYEOK |
分类号 |
H01L23/34;H01L23/12;H01L25/07 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor package device, comprising:
a lower package, comprising: a lower package substrate, a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package substrate, a first trench formed in the lower molding compound layer to surround the lower semiconductor chip, and a second trench connected to the first trench to extend to an outer wall of the lower package, the second trench being formed in the lower molding compound layer; an upper package disposed on the lower package, the upper package comprising: an upper package substrate, and at least one upper semiconductor chip mounted on the upper package substrate; and a heat transfer member disposed between the lower package and the upper package. |
地址 |
Suwon-si KR |